Fabrication of high-aspect ratio silicon nanopillars for tribological experiments

Pavlo V. Antonov*, Marc R. Zuiddam, Joost W.M. Frenken

*Corresponding author for this work

Research output: Contribution to JournalArticleAcademicpeer-review

Abstract

This article reports the results of the fabrication of large arrays of nanopillars for future tribological experiments. This fabrication focused on achieving a constant high aspect ratio up to 1:24 and a separation between each pair of adjacent pillars. Electron beam lithography was used to write patterns in hydrogen silsesquioxane (HSQ) negative tone resist. To achieve nanopillars of high aspect ratios and with smooth sides, deep reactive ion etching was employed with SF6 and O2 at cryogenic temperatures. Finally, the residual HSQ was removed using CHF3/O2 plasma etching in order to obtain a smooth finish.

Original languageEnglish
Article number044506
JournalJournal of Micro/ Nanolithography, MEMS, and MOEMS
Volume14
Issue number4
DOIs
Publication statusPublished - 1 Oct 2015
Externally publishedYes

Keywords

  • nanolithography
  • nanopillars
  • plasma etching
  • silicon
  • tribology

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