Fast and robust diffraction based overlay metrology using dark-field digital holographic microscopy

T. T.M. van Schaijk; C. Messinis; N. Pandey; V. T. Tenner; A. Koolen; S. Witte; J. F. de Boer; A. J. den Boef

doi:10.1117/12.2591989

Fast and robust diffraction based overlay metrology using dark-field digital holographic microscopy

T. T.M. van Schaijk^*, C. Messinis, N. Pandey, V. T. Tenner, A. Koolen, S. Witte, J. F. de Boer, A. J. den Boef

^*Corresponding author for this work

Research output: Chapter in Book / Report / Conference proceeding › Conference contribution › Academic › peer-review

Abstract

Digital holographic microscopy allows access to the complex electric field, enabling computational propagation of light. This enables computational corrections for lens aberrations, which remove the requirement for antireflective coatings on the lens and enable imaging over a wide spectral range. This makes digital holographic microscopy an interesting candidate for overlay metrology on semiconductor wafers. We show that a single holographic image contains all data that is required for computing the overlay, by using a source with a limited coherence length and incoherently adding multiple measurements on a camera. As an additional benefit we show that such parallel acquisition improves the reproducibility of the experiment by eliminating noise sources that are common to the two measurements that typically constitute a single overlay measurement.

Original language	English
Title of host publication	Optical Measurement Systems for Industrial Inspection XII
Editors	Peter Lehmann, Wolfgang Osten, Armando Albertazzi Goncalves
Publisher	SPIE
ISBN (Electronic)	9781510643987
DOIs	https://doi.org/10.1117/12.2591989
Publication status	Published - 2021
Event	Optical Measurement Systems for Industrial Inspection XII 2021 - Virtual, Online, Germany Duration: 21 Jun 2021 → 25 Jun 2021

Publication series

Name	Proceedings of SPIE - The International Society for Optical Engineering
Volume	11782
ISSN (Print)	0277-786X
ISSN (Electronic)	1996-756X

Conference

Conference	Optical Measurement Systems for Industrial Inspection XII 2021
Country/Territory	Germany
City	Virtual, Online
Period	21/06/21 → 25/06/21

Bibliographical note

Publisher Copyright:
© 2021 SPIE · CCC code: 0277-786X/21/$21

Copyright:
Copyright 2021 Elsevier B.V., All rights reserved.

Keywords

Dark-field imaging
Digital holographic microscopy
Overlay metrology
Semiconductor manufacturing

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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10.1117/12.2591989

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van Schaijk, T. T. M., Messinis, C., Pandey, N., Tenner, V. T., Koolen, A., Witte, S., de Boer, J. F., & den Boef, A. J. (2021). Fast and robust diffraction based overlay metrology using dark-field digital holographic microscopy. In P. Lehmann, W. Osten, & A. A. Goncalves (Eds.), Optical Measurement Systems for Industrial Inspection XII Article 117820O (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 11782). SPIE. https://doi.org/10.1117/12.2591989

van Schaijk, T. T.M. ; Messinis, C. ; Pandey, N. et al. / Fast and robust diffraction based overlay metrology using dark-field digital holographic microscopy. Optical Measurement Systems for Industrial Inspection XII. editor / Peter Lehmann ; Wolfgang Osten ; Armando Albertazzi Goncalves. SPIE, 2021. (Proceedings of SPIE - The International Society for Optical Engineering).

@inproceedings{0bd795616d6440108f090ccd9a237fd7,

title = "Fast and robust diffraction based overlay metrology using dark-field digital holographic microscopy",

abstract = "Digital holographic microscopy allows access to the complex electric field, enabling computational propagation of light. This enables computational corrections for lens aberrations, which remove the requirement for antireflective coatings on the lens and enable imaging over a wide spectral range. This makes digital holographic microscopy an interesting candidate for overlay metrology on semiconductor wafers. We show that a single holographic image contains all data that is required for computing the overlay, by using a source with a limited coherence length and incoherently adding multiple measurements on a camera. As an additional benefit we show that such parallel acquisition improves the reproducibility of the experiment by eliminating noise sources that are common to the two measurements that typically constitute a single overlay measurement.",

keywords = "Dark-field imaging, Digital holographic microscopy, Overlay metrology, Semiconductor manufacturing",

author = "{van Schaijk}, {T. T.M.} and C. Messinis and N. Pandey and Tenner, {V. T.} and A. Koolen and S. Witte and {de Boer}, {J. F.} and {den Boef}, {A. J.}",

note = "Publisher Copyright: {\textcopyright} 2021 SPIE · CCC code: 0277-786X/21/$21 Copyright: Copyright 2021 Elsevier B.V., All rights reserved.; Optical Measurement Systems for Industrial Inspection XII 2021 ; Conference date: 21-06-2021 Through 25-06-2021",

year = "2021",

doi = "10.1117/12.2591989",

language = "English",

series = "Proceedings of SPIE - The International Society for Optical Engineering",

publisher = "SPIE",

editor = "Peter Lehmann and Wolfgang Osten and Goncalves, {Armando Albertazzi}",

booktitle = "Optical Measurement Systems for Industrial Inspection XII",

address = "United States",

}

van Schaijk, TTM, Messinis, C, Pandey, N, Tenner, VT, Koolen, A, Witte, S , de Boer, JF & den Boef, AJ 2021, Fast and robust diffraction based overlay metrology using dark-field digital holographic microscopy. in P Lehmann, W Osten & AA Goncalves (eds), Optical Measurement Systems for Industrial Inspection XII., 117820O, Proceedings of SPIE - The International Society for Optical Engineering, vol. 11782, SPIE, Optical Measurement Systems for Industrial Inspection XII 2021, Virtual, Online, Germany, 21/06/21. https://doi.org/10.1117/12.2591989

Fast and robust diffraction based overlay metrology using dark-field digital holographic microscopy. / van Schaijk, T. T.M.; Messinis, C.; Pandey, N. et al.
Optical Measurement Systems for Industrial Inspection XII. ed. / Peter Lehmann; Wolfgang Osten; Armando Albertazzi Goncalves. SPIE, 2021. 117820O (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 11782).

Research output: Chapter in Book / Report / Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Fast and robust diffraction based overlay metrology using dark-field digital holographic microscopy

AU - van Schaijk, T. T.M.

AU - Messinis, C.

AU - Pandey, N.

AU - Tenner, V. T.

AU - Koolen, A.

AU - Witte, S.

AU - de Boer, J. F.

AU - den Boef, A. J.

PY - 2021

Y1 - 2021

N2 - Digital holographic microscopy allows access to the complex electric field, enabling computational propagation of light. This enables computational corrections for lens aberrations, which remove the requirement for antireflective coatings on the lens and enable imaging over a wide spectral range. This makes digital holographic microscopy an interesting candidate for overlay metrology on semiconductor wafers. We show that a single holographic image contains all data that is required for computing the overlay, by using a source with a limited coherence length and incoherently adding multiple measurements on a camera. As an additional benefit we show that such parallel acquisition improves the reproducibility of the experiment by eliminating noise sources that are common to the two measurements that typically constitute a single overlay measurement.

AB - Digital holographic microscopy allows access to the complex electric field, enabling computational propagation of light. This enables computational corrections for lens aberrations, which remove the requirement for antireflective coatings on the lens and enable imaging over a wide spectral range. This makes digital holographic microscopy an interesting candidate for overlay metrology on semiconductor wafers. We show that a single holographic image contains all data that is required for computing the overlay, by using a source with a limited coherence length and incoherently adding multiple measurements on a camera. As an additional benefit we show that such parallel acquisition improves the reproducibility of the experiment by eliminating noise sources that are common to the two measurements that typically constitute a single overlay measurement.

KW - Dark-field imaging

KW - Digital holographic microscopy

KW - Overlay metrology

KW - Semiconductor manufacturing

UR - http://www.scopus.com/inward/record.url?scp=85109414745&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85109414745&partnerID=8YFLogxK

U2 - 10.1117/12.2591989

DO - 10.1117/12.2591989

M3 - Conference contribution

AN - SCOPUS:85109414745

T3 - Proceedings of SPIE - The International Society for Optical Engineering

BT - Optical Measurement Systems for Industrial Inspection XII

A2 - Lehmann, Peter

A2 - Osten, Wolfgang

A2 - Goncalves, Armando Albertazzi

PB - SPIE

T2 - Optical Measurement Systems for Industrial Inspection XII 2021

Y2 - 21 June 2021 through 25 June 2021

ER -

van Schaijk TTM, Messinis C, Pandey N, Tenner VT, Koolen A, Witte S et al. Fast and robust diffraction based overlay metrology using dark-field digital holographic microscopy. In Lehmann P, Osten W, Goncalves AA, editors, Optical Measurement Systems for Industrial Inspection XII. SPIE. 2021. 117820O. (Proceedings of SPIE - The International Society for Optical Engineering). Epub 2021 Jun 20. doi: 10.1117/12.2591989

Fast and robust diffraction based overlay metrology using dark-field digital holographic microscopy

Abstract

Publication series

Conference

Bibliographical note

Keywords

UN SDGs

Access to Document

Persistent URL (handle)

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Cite this