Proposed High Level Architecture of a Smart Interconnected Interactive Classroom

C. Stergiou, A. P. Plageras, K. E. Psannis, T. Xifilidis, George Kokkonis, Sotirios Kontogiannis, Katerina Tsarava, Androniki Sapountzi

Research output: Chapter in Book / Report / Conference proceedingConference contributionAcademicpeer-review

Abstract

This paper presents the high level architecture of a smart, modern, interactive laboratory-class called Smart Interconnected Interactive Classroom (SIIC). It describes the interoperability of telecommunication technologies, sensors and actuators over a virtual environment that enhances the learning process and experience. In the context of this work novel augmented and virtual services are outlined that can assist e-Learning systems through virtual reality and real-time interactions.

Original languageEnglish
Title of host publicationSouth-East Europe Design Automation, Computer Engineering, Computer Networks and Social Media Conference, SEEDA_CECNSM 2018
PublisherInstitute of Electrical and Electronics Engineers, Inc.
Pages1-6
Number of pages6
ISBN (Electronic)9786188331419
DOIs
Publication statusPublished - 26 Nov 2018
Event2018 South-East Europe Design Automation, Computer Engineering, Computer Networks and Social Media Conference, SEEDA_CECNSM 2018 - Kastoria, Greece
Duration: 22 Sep 201824 Sep 2018

Conference

Conference2018 South-East Europe Design Automation, Computer Engineering, Computer Networks and Social Media Conference, SEEDA_CECNSM 2018
CountryGreece
CityKastoria
Period22/09/1824/09/18

Keywords

  • Big Data
  • Cloud services
  • Haptic technology
  • Internet of Things
  • middleware protocols
  • Smart Classroom
  • virtual reality

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  • Cite this

    Stergiou, C., Plageras, A. P., Psannis, K. E., Xifilidis, T., Kokkonis, G., Kontogiannis, S., ... Sapountzi, A. (2018). Proposed High Level Architecture of a Smart Interconnected Interactive Classroom. In South-East Europe Design Automation, Computer Engineering, Computer Networks and Social Media Conference, SEEDA_CECNSM 2018 (pp. 1-6). [8544922] Institute of Electrical and Electronics Engineers, Inc.. https://doi.org/10.23919/SEEDA-CECNSM.2018.8544922